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  1. 2008/04/30 UD200 - High Power Chipled

UD200 - High Power Chipled

ETC 2008/04/30 09:23
Features
* Directive characteristic.......................................110˚ (optional with lens 40˚)              
* Size.................................................................................3.2 (L) x 2.8 (W)
* Soldering patterns......................................................................Gld plated
* Technology........................................................................AllnGaP, InGaN
* Tape & Reel..............................8 mm blister tape with 2000pcs./reel 0 180mm
                                                 or 8000pcs./reel 0 330mm                                                
* Grouping parameter............sorted into luminous intensity groups, color groups
                                          or color coordinates
* ESD resistance voltage...............................................................up to 2 kV.
* Assembly methods..............................suitable for all SMT assembly methods
* Soldering methods...............................IR reflow soldering and TTW soldering

Applications
* Substition of incandescent lamps
* Signal and indicators
* Marker lights
* Indoor and outdoor displays
* Backlighting
* Interior and exterior automotive lighting

Special features
The SMT LED elements of the EOC-20 series operate from 50 mA to 200 mA:
For optimal use of the EOC-20 SMT LEDs please ask for our special assistance regarding the
PCB layout to optimise the thermal management.
Please see the fields of application from the ordering code.
With an optimal thermal management power dissipation up to 1500 mW can be realised.

EOC-20UW50
EOC-20MB460100
EOC-20HD200

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