Description
CPC1008N is a miniature low voltage, low on resistance 1-Form-A solid state relay in a 4 pin SOP package. The relay uses optically coupled MOSFET technology to provide 1500V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS® architecture. The optically-coupled input is controlled by a highly efficient GaAIAs infrared LED. The CPC1008N uses Clare’s state of the art double molded vertical construction packaging to produce the world’s smallest relay. The CPC1008N is ideal for replacing larger less reliable reed and electromechanical relays.

Features
*Small 4 Pin SOP Package
*Low Drive Power Requirements (TTL/CMOS Compatible)
*No Moving Parts
*High Reliability
*Arc-Free With No Snubbing Circuits
*1500VRMS Input/Output Isolation
*FCC Compatible
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable
*Tape & Reel Version Available

Applications
*Instrumentation
-Multiplexers
-Data Acquisition
-Electronic Switching
-I/O Subsystems
-Meters (Watt-Hour, Water, Gas)
*Medical Equipment—Patient/Equipment Isolation
*Security Systems
*Aerospace
*Industrial Controls
*Reed Relay Replacement

CPC1008NTR

TAG OptoMOS, Relay

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Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays.
As part of this family, the CPC1986J single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 1.6Arms continuous load current with a 5ºC/W heat sink.
The CPC1986J employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications.
The unique i4-PAC package pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.35 °C/W).

Features
*Compact i4-PAC Power Package
*Low Thermal Resistance (0.35 °C/W)
*1.6Arms Load Current with 5ºC/W Heat Sink
*Electrically Non-conductive Thermal Pad for Heat Sink Applications
*Low Drive Power Requirements
*Arc-Free With No Snubbing Circuits
*2500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable

Applications
*Industrial Controls
*Motor Control
*Robotics
*Medical Equipment-Patient/Equipment Isolation
*Instrumentation
-Multiplexers
-Data Acquisition
-Electronic Switching
-I/O Subsystems
-Meters (Watt-Hour, Water, Gas)
*Transportation Equipment
*Aerospace/Defense

CPC1986J
TAG Power, Relay

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Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays.
As part of this family, the CPC1979 single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 3.5Arms continuous load current with a 5ºC/W heat sink.
The CPC1979 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications.
The unique ISOPLUS-264 package pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.3 °C/W).

Features
*Compact ISOPLUS-264 Power Package
*Low Thermal Resistance (0.3 °C/W)
*3.5Arms Load Current with 5°C/W Heat Sink
*Electrically Non-conductive Thermal Pad for Heat Sink Applications
*Low Drive Power Requirements
*Arc-Free With No Snubbing Circuits
*2500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable

Applications
*Industrial Controls
*Motor Control
*Robotics
*Medical Equipment—Patient/Equipment Isolation
*Instrumentation
-Multiplexers
-Data Acquisition
-Electronic Switching
-I/O Subsystems
-Meters (Watt-Hour, Water, Gas)
*Transportation Equipment
*Aerospace/Defense

CPC1979J
TAG Power, Relay

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Description
CPC1004N is a miniature low voltage, low on resistance 1-Form-A DC solid state relay in a 4 pin SOP package. The relay uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switch and photovoltaic die use Clare’s patented OptoMOS® architecture. The optically-coupled input is controlled by a highly efficient GaAIAs infrared LED. The CPC1004N uses Clare’s state of the art double molded vertical construction packaging to produce the world’s smallest relay. The CPC1004N is ideal for replacing larger less reliable reed and electromechanical relays.

Features
*Small 4 Pin SOP Package
*Low Drive Power Requirements (TTL/CMOS Compatible)
*No Moving Parts
*High Reliability
*Arc-Free With No Snubbing Circuits
*1500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable
*Tape & Reel Version Available

Applications
*Instrumentation
-Multiplexers
-Data Acquisition
-Electronic Switching
-I/O Subsystems
-Meters (Watt-Hour, Water, Gas)
*Medical Equipment—Patient/Equipment Isolation
*Security Systems
*Aerospace
*Industrial Controls
*Reed Relay Replacement

CPC1004NTR
TAG OptoMOS, Relay

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Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. As part of that family, the CPC1973Y is a 1-Form-A solid state relay. The CPC1973Y employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS architecture while the input is controlled by a highly efficient GaAlAs infrared LED. The combination of low on resistance and high load current handling capabilities makes the relay suitable for a variety of high performance switching applications.

Features
*Power SIP Package
*Handle Load Currents Up to 0.5A
*High Reliability
*No Moving Parts
*Low Drive Power Requirements (TTL/CMOS Compatible)
*Arc-Free With No Snubbing Circuits
*2500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable

Approvals
*UL recognized component: File # E69938
*Certified to: UL 508
TAG Power, Relay, SIP

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Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1709 single pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET switch and photovoltaic die that uses Clare’s patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically-coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.
The unique ISOPLUS-264 package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.3°C/W).

Features
*100% Solid State
*Compact ISOPLUS-264 Power Package
*Low Thermal Resistance (0.3°C/W)
*22.8ADC Load Current with 5°C/W Heat Sink
*Electrically Non-conductive Thermal Pad for Heat Sink Applications
*Low Drive Power Requirements
*Arc-Free With No Snubbing Circuits
*2500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable

Applications
*Industrial Controls
*Motor Control
*Robotics
*Medical Equipment—Patient/Equipment Isolation
*Instrumentation
- Multiplexers
- Data Acquisition
- Electronic Switching
- I/O Subsystems
- Meters (Watt-Hour, Water, Gas)
*Transportation Equipment
*Aerospace/Defense

CPC1709J
TAG DC, Power, Relay

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Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1786 single pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET switch and photovoltaic die that uses Clare’s patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high-performance DC switching applications.
The unique i4-PAC package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.35°C/W).

Features
*100% Solid State
*Compact i4-PAC™ Power Package
*Low Thermal Resistance (0.35°C/W)
*1.75ADC Load Current with 5ºC/W Heat Sink
*Electrically Non-conductive Thermal Pad for Heat Sink Applications
*No Moving Parts
*Low Drive Power Requirements
*Arc-Free With No Snubbing Circuits
*2500Vrms Input/Output Isolation
*No EMI/RFI Generation
*Machine Insertable, Wave Solderable

Applications
*Industrial Controls
*Motor Control
*Robotics
*Medical Equipment—Patient/Equipment Isolation
*Instrumentation
*Multiplexers
*Data Acquisition
*Electronic Switching
*I/O Subsystems
*Meters (Watt-Hour, Water, Gas)
*Transportation Equipment
*Aerospace/Defense

CPC1786J
TAG Power, Relay

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Features
• Compact ISOPLUS-264 Power Package
• Low Thermal Resistance (0.3 °C/W)
• 15Arms Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable

Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense

Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability, and compact size to a new family of high-power Solid State Relays.
As part of this family, the CPC1909 single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 15Arms continuous load current with a 5ºC/W heat sink.
The CPC1909 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by IXYS allows Solid State Relays to achieve the
highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.3 °C/W).

CPC1909J
TAG Relay

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The B41 is four independent form A channels in one planar quad package. Coto’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 Ω environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies.
This is particularly important in Mixed Signal IC testers. This four-inone BGA packaging allows relays to be integrated easily on boards designed for surface mount processing.

Series Features
* Planar BGA Surface Mount
* Ability to pass GHz signals
* Rise time < 45 ρSec
* ~50 Ω Characteristic Impedance
* Low Capacitance
* Patented Design

Applications
* IC Testers
* In-Line Relay Testers
* Memory Testers
* Mixed Signal Testers
* High Bandpass Applications

B41-0001

TAG Relay, RF

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Features
• Compact i4-PAC™ Power Package
• Low Thermal Resistance
• Heat Sink Option
• Handle Load Currents Up to 2.5Arms (free air)
• High Reliability
• No Moving Parts
• Low Drive Power Requirements (TTL/CMOS Compatible)
• Arc-Free With No Snubbing Circuits
• 2500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable

Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense

Description
Clare and IXYS have combined to bring OptoMOS technology, reliability and compact size to a new family of high power solid state relays. The CPC1978J, a 1-Form-A solid state relay, is part of this new family. The CPC1978J employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS architecture while the input is controlled by a highly efficient GaAlAs infrared LED. The combination of low on resistance and high load current handling capability makes the relay suitable for a variety of high performance switching applications.
The unique i4-PAC™ package pioneered by IXYS allows solid state relays to achieve the highest current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance.
TAG Power, Relay

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