MECHANICAL CHARACTERISTICS
*Standard EIA Chip Size: 0408
*Weight 0.73 milligrams (Approximate)
*Available in Tin-Lead or Lead-Free Plating
*Solder Reflow Temperature:
-Tin-Lead - Sn/Pb, 85/15: 240-245°C
-Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
*Flammability Rating UL 94V-0
*8mm Plastic & Paper Tape and Reel Per EIA Standard 481
*Device Marking On Reel
*Top Contacts: Solder Bump 0.004” in Height (Nominal)


FEATURES
*ESD Protection > 25 kilovolts
*Available in Voltages Ranging From 3.3V to 36V
*200 Watts Peak Pulse Power per Line (tp = 8/20μs)
*Low Clamping Voltage
*Bidirectional Configuration & Monolithic Structure
*Protects 4 to 7 Lines
*LOW CAPACITANCE
*LOW LEAKAGE CURRENT
*RoHS Compliant in Lead-Free Versions


APPLICATIONS

*Cellular Phones
*Personal Digital Assistant (PDA)
*Notebook Computers
*SMART Cards

IEC COMPATIBILITY (EN61000-4)
*61000-4-2 (ESD): Air - 15kV, Contact - 8kV
*61000-4-4 (EFT): 40A - 5/50ns

LC0408FC3.3C, LC0408FC05C, LC0408FC08C, LC0408FC12C, LC0408FC15C, LC0408FC24C, LC0408FC36C

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APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES
✔ ESD Protection > 25 kilovolts
✔ Low ESD Overshoot Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ Low Capacitance: 6pF
✔ Low Leakage Current
✔ RoHS Compliant

MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0402
✔ Weight 0.73 milligrams (Approximate)
✔ Solder Reflow Temperature:
 -Lead-Free: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel

ULLC0402FC05C-T75-1 ULLC0402FC05C-T710-2


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