The Micron® QDR™II (Quad Data Rate™) synchronous, pipelined burst SRAM employs high-speed, lowpower CMOS designs using an advanced 6T CMOS process.
The QDR architecture consists of two separate DDR (double data rate) ports to access the memory array. The read port has dedicated data outputs to support READ operations. The write port has dedicated data inputs to support WRITE operations. This architecture eliminates the need for high-speed bus turnaround. Access to each port is accomplished using a common address bus. Addresses for reads and writes are latched on rising edges of the K and K# input clocks, respectively. Each address location is associated with two words that burst sequentially into or out of the device.
GENERAL DESCRIPTION (continued) Since data can be transferred into and out of the device on every rising edge of both clocks (K and K#, C and C#), memory bandwidth is maximized while system design is simplified by eliminating bus turnarounds.
Depth expansion is accomplished with port selects for each port (read R#, write W#), which are received at K rising edge. Port selects permit independent port operation.
All synchronous inputs pass through registers controlled by the K or K# input clock rising edges. Active LOW byte writes (BWx#) permit byte or nibble write selection. Write data and byte writes are registered on the rising edges of both K and K#. The addressing within each burst of two is fixed and sequential, beginning with the lowest and ending with the highest address. All synchronous data outputs pass through output registers controlled by the rising edges of the output clocks (C and C# if provided, otherwise K and K#).
Four balls are used to implement JTAG test capabilities: test mode select (TMS), test data-in (TDI), test clock (TCK), and test data-out (TDO). JTAG circuitry is used to serially shift data to and from the SRAM. JTAG inputs use JEDEC-standard 1.8V I/O levels to shift data during this testing mode of operation.
The SRAM operates from a +1.8V power supply, and all inputs and outputs are HSTL-compatible. The device is ideally suited for applications that benefit from a high-speed, fully-utilized DDR data bus.

*DLL circuitry for accurate output data placement
*Separate independent read and write data ports with concurrent transactions
*100 percent bus utilization DDR READ and WRITE operation
*Fast clock to valid data times
*Full data coherency, providing most current data
*Two-tick burst counter for low DDR transaction size
*Double data rate operation on read and write ports
*Two input clocks (K and K#) for precise DDR timing at clock rising edges only
*Two output clocks (C and C#) for precise flight time and clock skew matching—clock and data delivered together to receiving device
*Single address bus
*Simple control logic for easy depth expansion
*Internally self-timed, registered writes
*+1.8V core and HSTL I/O
*Clock-stop capability
*15mm x 17mm, 1mm pitch, 11 x 15 grid FBGA package
*User-programmable impedance output
*JTAG boundary scan

MT54W4MH9B, MT54W2MH18B, MT54W1MH36B

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General Description
The S29NS128J, S29NS064J, S29NS032J and S29NS016J are 128 Mbit, 64 Mbit, 32 Mbit and 16 Mbit 1.8 Volt-only, Simultaneous Read/Write, Burst Mode Flash memory devices, organized as 8,388,608, 4,194,304, 2,097,152 and 1,048,576. words of 16 bits each. These devices use a single VCC of 1.7 to 1.95 V to read, program, and erase the memory array. A 12.0-volt Acc may be used for faster program performance if desired. These devices can also be programmed in standard EPROM programmers.

*Single 1.8 volt read, program and erase (1.7 to 1.95 V)
*Multiplexed Data and Address for reduced I/O count
– A15–A0 multiplexed as DQ15–DQ0
– Addresses are latched by AVD# control input when CE# low
*Simultaneous Read/Write operation
– Data can be continuously read from one bank while executing erase/program functions in other bank
– Zero latency between read and write operations
*Read access times at 54 MHz (CL=30 pF)
– Burst access times of 11/13.5 ns at industrial temperature range
– Asynchronous random access times of 65/70 ns
– Synchronous random access times of 71/87.5 ns
*Burst Modes
– Continuous linear burst
– 8/16/32 word linear burst with wrap around
– 8/16/32 word linear burst without wrap around
*Power dissipation (typical values, 8 bits switching, CL = 30 pF)
– Burst Mode Read: 25 mA
– Simultaneous Operation: 40 mA
– Program/Erase: 15 mA
– Standby mode: 9 μA
*Sector Architecture
– Four 8 Kword sectors
– Two hundred fifty-five (S29NS128J), one hundred twenty-seven (S29NS064J),sixty-three (S29NS032J), or thirty-one (S29NS016J) 32 Kword sectors
– Four banks (see next page for sector count and size)
*Sector Protection
– Software command sector locking
– WP# protects the two highest sectors
– All sectors locked when Acc = VIL
*Handshaking feature
– Provides host system with minimum possible latency by monitoring RDY
*Supports Common Flash Memory Interface (CFI)
*Software command set compatible with JEDEC 42.4 standards
– Backwards compatible with Am29F and Am29LV families
*Manufactured on 110 nm process technology
*Embedded Algorithms
– Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors
– Embedded Program algorithm automatically writes and verifies data at specified addresses
*Data# Polling
– Provides a software method of detecting program and erase operation completion
*Erase Suspend/Resume
– Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation
*Hardware reset input (RESET#)
– Hardware method to reset the device for reading array data
*CMOS compatible inputs and outputs
– 48-ball Very Thin FBGA (S29NS128J)
– 44-ball Very Thin FBGA (S29NS064J, S29NS032J, S29NS016J)
*Cycling Endurance: 1 million cycles per sector typical
*Data Retention: 20 years typical

S29NS128J0LBAW000, S29NS064J0LBAW000, S29NS032J0LBAW000

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