Features
*Package with DCB ceramic base plate
*Soldering connections for PCB mounting
*Isolation voltage 3600 V~
*Low RDS(on) HDMOSTM process
*Low package inductance for high speed switching
*Ultrafast boost diode
*Kelvin source for easy drive

Applications
*Power factor pre-conditioner for SMPS, UPS, battery chargers and inverters
*Boost topology for SMPS including 1~ rectifier bridge
*Power supply for welding equipment

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