FEATURES
*G.709 digital wrapper
*Provides FEC statistics: total corrected bits, corrected bytes and uncorrectable blocks
*G.975 Reed-Solomon RS(255,239) FEC
*Extracts and inserts OTU and SONET/SDH section and line overhead bytes.
*Extracts and inserts DCC and GCC bytes.
*Bidirectional SONET/SDH Performance Monitor
*Performs frame and byte alignment on received OTU and SONET/SDH frames.
*Bidirectional 10 Gigabit Ethernet performance monitor
*Scrambles and unscrambles OTU and SONET/SDH frames.
*Monitors and reports OOF/LOS/LOF/SD/SF/LOM/OOM or OTU and SONET/SDH frames.
*Monitors K1/K2 to report APS/AIS/RDI conditions.
*Inserts AIS on SONET/SDH frames.
*Monitors M1 to report REI on SONET/SDH frames.
*Monitors S1 for mismatch and inconsistent values.
*Monitors and reports J0 byte messages.
*Monitors B1/B2 to report parity errors on SONET/SDH frames.
*Generates and inserts B1/B2 bytes on SONET/SDH frames.
*Includes integrated 10 Gigabit Transceiver (9.953, 10.037, 10.312, 10.664, 10.709 and 11.09 Gbps) with limiting amp.
*16-bit microprocessor interface

APPLICATIONS
*DWDM long haul transport
*DWDM metro transport
*Next-generation SONET/SDH multiplexers
*Digital cross connects
*Fiber-optic terminators and test equipment

SUMMARY OF BENEFITS
*The first and only 10G digital wrapper/FEC/PM chip with integrated 10G transceiver in the industry.
*Integrated transceiver exceeds all SONET/SDH jitter specifications.
*Single chip supporting both SONET/SDH and 10 Gigabit Ethernet data.
*Bidirectional device with separate receive and transmit paths.
*Transparent error correction and detection.
*Integrated cleanup PLL with external VCXO.
*Sample phase adjustment provides better noise immunity.
*Seamless connection to Broadcom multiplexer/demultiplexer devices using SFI-4 interface.
*Compact, low-profile package: 31 mm ∞ 31 mm, HSBGA
*Ultra-low power consumption: 2W
*Standard 0.13 micron CMOS process
*SFI-4 parallel interface (622, 627, 644, 666, 669 and 692 Mbps).
*IEEE 1149.1 JTAG

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