DESCRIPTION
The MIL-COTS V•I Chip Bus Converter Module is a high efficiency (>95%) Sine Amplitude Converter (SAC) operating from a 240 to 330 Vdc primary bus to deliver an isolated 30 – 41.2 V nominal, unregulated secondary.
The VMB0004MFJ and VMB0004MFT are provided in a V•I Chip package compatible with standard pick-and-place and surface mount assembly processes.
FEATURES
*270 Vdc – 33.75 Vdc 235 W Bus Converter Module
*MIL-STD-704E/F Compliant
*High efficiency (>95%) reduces system power consumption
*High power density (796 W/in3) reduces power system footprint by >40%
*Contains built-in protection features: undervoltage, overvoltage lockout, over current protection, short circuit protection, overtemperature protection.
*Provides enable/disable control, internal temperature monitoring
*Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
*High Voltage 270 V Aircraft Distributed Power
*28 Vdc MIL-COTS PRM Interface (MP028F036M12AL)
*High Density Power Supplies
*Communication Systems
VMB0004MFT
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component.
For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 180 - 375V
*Input surge withstand: 400V for 100ms
*DC output: 24V
*Programmable output: 10 to 110%
*Regulation: ±0.3%
*Efficiency: 87.5%
*Maximum operating temperature : 100°C at full load
*Power density: 100W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications
*off-line systems, distributed power and electric vehicles
DC048B010T010FP, DC048B010M010FP, DC048B010T010TP
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 250 - 425V
*Input surge withstand: 500V for 100ms
*DC output: 15V
*Programmable output: 10 to 110%
*Regulation: ±0.2% no load to full load
*Efficiency: 87%
*Maximum operating temperature: 100°C at full load
*Power density: 119W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications
*distributed power; off-line systems using power PFC front-ends; electric vehicles
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 36 - 75V
*Input surge withstand: 100V for 100ms
*DC output: 2V
*Programmable output: 10 to 110%
*Regulation: ±0.2%
*Efficiency: 75.5%
*Maximum operating temperature: 100°C at full load
*Power density: 40W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications
*telecommunications and distributed power systems
V24A15C250A, V48A15C250A, V300A15C250A, V375A15C250A
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 18 - 36V
*Input surge withstand: 50V for 100ms
*DC output: 28V
*Programmable output: 10 to 110%
*Regulation: ±0.2% no load to full load
*Efficiency: 88.5%
*Maximum operating temperature: 100°C at full load
*Power density: 79W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications
telecommunications, process control and distributed power systems
V24A12C500A, V48A12C500A, V300A12C500A, V375A12C500A
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component.
For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 18 - 36V
*Input surge withstand: 50V for 100ms
*DC output: 12V
*Programmable output: 10 to 110%
*Regulation: ±0.2% no load to full load
*Efficiency: 85.5%
*Maximum operating temperature: 100°C at full load
*Power density: 79W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications
*telecommunications, process control and distributed power systems
V24A12C500A, V48A12C500A, V300A12C500A, V375A12C500A
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component.
For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching,
advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 36 - 75V
*Input surge withstand: 100V for 100ms
*DC output: 3.3V
*Programmable output: 10 to 110%
*Regulation: ±0.3% no load to full load
*Efficiency: 79.5%
*Maximum operating temperature: 100°C at full load
*Power density: 52W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
Typical Applications: telecommunications and distributed power systems
V48A3V3C264A, V24A12C500A, V48A12C500A
DESCRIPTION
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
*DC input range: 36 - 75V
*Input surge withstand: 100V for 100ms
*DC output: 24V
*Programmable output: 10 to 110%
*Regulation: ±0.2%
*Efficiency: 88.5%
*Maximum operating temperature: 100°C at full load
*Power density: 100W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture
V24A15C250A, V48A15C250A, V300A15C250A, V375A15C250A, V24B15C250A, V48B15C250A, V300B15C250A, V375B15C250A, V24C15C250A, V48C15C250A, V300C15C250A, V375C15C250A, V24A15T250A, V48A15T250A, V300A15T250A, V375A15T250A, V24B15T250A, V48B15T250A, V300B15T250A, V375B15T250A, V24C15T250A, V48C15T250A, V300C15T250A, V375C15T250A, V24A15H250A, V48A15H250A, V300A15H250A, V375A15H250A, V24B15H250A, V48B15H250A, V300B15H250A, V375B15H250A, V24C15H250A, V48C15H250A, V300C15H250A, V375C15H250A, V24A15M250A, V48A15M250A, V300A15M250A, V375A15M250A, V24B15M250A, V48B15M250A, V300B15M250A, V375B15M250A, V24C15M250A, V48C15M250A, V300C15M250A, V375C15M250A
Product Overview
VI Brick DC-DC converters use advanced Sine Amplitude ConverterTM (SACTM)
technology, thermally enhanced packaging technologies, and advanced CIM
processes to provide high power density and efficiency, superior transient
response, and improved thermal management. The high speed 3.5 MHz, zero
current switching–zero voltage switching (ZCS–ZVS) design enables efficient and
low noise operation throughout the operating range.
Features
* DC input range: 36 – 75 V
* Efficiency: Up to 93%
* DC output: 1 – 48 V
* Maximum operating temp:100°C, full load
* Isolated output
* Low noise: Sine Amplitude ConverterTM (SACTM) technology
* Highly efficient:ZCS/ZVS switching
* Fast dynamic response
* Low profile:0.37 in. (9.5 mm)
* RoHS Compliant
* Power density up to 145 W/in3
* Agency approvals
Applications
* Communications
* Distributed power
* ATE
* Defense
* Aerospace
* Medical
* And other applications requiring high efficiency
Product Overview
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component.
For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients.
Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.
Features
* DC input range: 18 - 36V
* Input surge withstand: 50V for 100ms
* DC output: 24V
* Programmable output: 10 to 110%
* Regulation: ±0.2% no load to full load
* Efficiency: 87%
* Maximum operating temperature: 100°C at full load
* Power density: 60W/cubic inch
* Height above board: 0.43 in. (10,9 mm)
* Parallelable, with N+M fault tolerance
* Low noise ZCS/ZVS architecture
Typical Applications
* telecommunications, process control and distributed power systems
